Standard

IEC 60749-42:2014 ED1

Aug 2014 Published

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Abstract

IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Document information

Standard from IEC
Published: 12 August 2014
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.080.01
ISO TC TC 47

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Adopted by: NEK IEC 61691-1-1:2004
FRANKFURT AGREEMENT: FprEN 60749-42:2014

IEC 60749-42:2014 ED1

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Abstract

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Abstract

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