Standard

IEC 61188-5-4:2007 ED1

Oct 2007 Published

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Abstract

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Document information

Standard from IEC
Published: 30 October 2007
Edition: 1
Version: 1
Document type: IS
ISBN: 2831893410

ICS 31.180
ISO TC TC 91

Product Relations

Partially replaced by: IEC 61188-6-3:2024 ED1
Partially replaced by: IEC 61188-6-2:2021 ED1

IEC 61188-5-4:2007 ED1

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Abstract

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Abstract

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