Standard

IEC 62137-1-1:2007 ED1

Jul 2007 Published

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Abstract

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Document information

Standard from IEC
Published: 11 July 2007
Edition: 1
Version: 1
Document type: IS
ISBN: 2831892236

ICS 31.190
ISO TC TC 91

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Adopted by: NEK IEC 60204-31:2001

IEC 62137-1-1:2007 ED1

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Abstract

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Abstract

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