Standard

NEK EN 60068-2-83:2011

Nov 2011 Published

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Abstract

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Document information

Standard from NEK
Published: 1 November 2011
Edition: 2011-10
Version: 1
Document type: NAT
ISBN:

National Committee NEK/NK91
ICS 19.040
ICS 31.190

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Replaced by: NEK EN IEC 60068-2-83:2025
Adopted from: EN 60068-2-83:2011 , 0

NEK EN 60068-2-83:2011

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Abstract

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