Standard

NEK IEC PAS 62085:1998

Dec 1998 Withdrawn

Corrigendums and amendments are bought separately.

Language English

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Abstract

Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.

Document information

Standard from NEK
Published: 3 December 1998
Withdrawn: 2 December 2004
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 33.200

NEK IEC PAS 62085:1998

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Abstract

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Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

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