Standard

IEC 60068-2-69:1995 ED1

Dec 1995 Revised

Note: This standard has a new edition: IEC 60068-2-69:2017+AMD1:2019 CSV

Corrigendums and amendments are bought separately.

Language English/French

Services Read Online (No printing ) kr 2 326,00 Printed and bound Delivery time: 5-10 days kr 2 908,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Document information

Standard from IEC
Published: 8 December 1995
Withdrawn: 9 May 2007
Edition: 1
Version: 1
Document type: IS
ISBN: 283183628X

ICS 19.040
ISO TC TC 91

Product Relations

Revised by: IEC 60068-2-69:2007 ED2

Product life cycle

Current product

Revised

IEC 60068-2-69:1995 ED1
Stage 99.60
Revised by

Revised

IEC 60068-2-69:2007 ED2

IEC 60068-2-69:1995 ED1

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

IEC 60068-2-69:2017+AMD1:2019 CSV

IEC 60068-2-69:2017 ED3

IEC 60068-2-69:2007 ED2