Standard

IEC 60127-4:1996 ED2

Revised

Note: This standard has a new edition: IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV

Corrigendums and amendments are bought separately.

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Abstract

Applies to Universal Modular Fuse-Links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors.

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 2
  • Version: 1
  • Document type: IS
  • ICS 29.120.50
  • ISO TC TC 32/SC 32C

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