Standard

IEC 60191-6-18:2010 ED1

Jan 2010 Published

Preview External link

Corrigendums and amendments are bought separately.

Language English English/French

Services Read Online (No printing ) kr 1 759,00

There are no extended editions available for this standard

Open product

Please wait...
Open product

Please wait...

Standard

IEC 60191-6-18:2010 ED1
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Jan 2010 Published
Standard

IEC PAS 60191-6-18:2008 ED1
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Jan 2008 Replaced

Abstract

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Document information

Standard from IEC
Published: 7 January 2010
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.080.01
ISO TC TC 47/SC 47D

Product Relations

Replaces: IEC PAS 60191-6-18:2008 ED1
Adopted by: NEK IEC 60512-7:1993

IEC 60191-6-18:2010 ED1

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer