Standard

IEC 61188-5-2:2003 ED1

Jun 2003 Published

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Abstract

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Document information

Standard from IEC
Published: 24 June 2003
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.180
ICS 31.190
ISO TC TC 91

Product Relations

Partially replaced by: IEC 61188-6-3:2024 ED1
Partially replaced by: IEC 61188-6-2:2021 ED1

IEC 61188-5-2:2003 ED1

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Abstract

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Abstract

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