Consolidated

IEC 61189-3:1997+AMD1:1999 CSV

Nov 2006 Revised

Note: This standard has a new edition: IEC 61189-3:2007 ED2

Corrigendums and amendments are bought separately.

Language English/French

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Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.

Document information

Consolidated from IEC
Published: 27 November 2006
Withdrawn: 9 October 2007
Edition: 1.1
Version: 1
Document type: IS
ISBN: 2831888301

ICS 31.180
ISO TC TC 91

Product Relations

Revised by: IEC 61189-3:2007 ED2

Product life cycle

Current product

Revised

IEC 61189-3:1997+AMD1:1999 CSV
Revised by

Published

IEC 61189-3:2007 ED2

IEC 61189-3:1997+AMD1:1999 CSV

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IEC 61189-3:2007 ED2