Consolidated

IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV

Published
Preview

Corrigenda and amendments are bought separately.

Language
Services

Abstract

IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: - revision of the figures to match the notation of the drawings of IEC 61240:2016; - addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.

Document information

  • Consolidated from IEC
  • Published:
  • Edition: 3.2
  • Version: 1
  • Document type: IS
  • ICS 31.140
  • ISO TC TC 49

Product Relations

Product life cycle