Standard

IEC 63011-3:2018 ED1

Nov 2018 Published

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Abstract

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC. Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

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Standard from IEC
Published: 28 November 2018
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.200
ISO TC TC 47/SC 47A

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Abstract

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