Standard

IEC PAS 62137-3:2008 ED1

Nov 2008 Replaced

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Document information

Standard from IEC
Published: 13 November 2008
Withdrawn: 8 November 2011
Edition: 1
Version: 1
Document type: PAS
ISBN: 9782889108091

ICS 31.190
ISO TC TC 91

Product Relations

Replaced by: IEC 62137-3:2011 ED1
Adopted by: NEK IEC TR 60664-2-1:1997
Adopted by: NEK IEC 60745-2-15:1984

Product life cycle

Current product

Replaced

IEC PAS 62137-3:2008 ED1
Stage 99.60
Replaced by

Published

IEC 62137-3:2011 ED1

IEC PAS 62137-3:2008 ED1

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Abstract

Document information

Product Relations

Product life cycle

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations

Product life cycle