Standard

IEC TR 62258-3:2005 ED1

Jun 2005 Revised

Note: This standard has a new edition: IEC TR 62258-3:2010 ED2

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Language English

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Abstract

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - singulated bare die, - minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

Document information

Standard from IEC
Published: 13 June 2005
Withdrawn: 6 August 2010
Edition: 1
Version: 1
Document type: TR
ISBN: 2831879892

ICS 31.080.99
ISO TC TC 47

Product Relations

Revised by: IEC TR 62258-3:2010 ED2
Adopted by: NEK IEC 60181B:1966

Product life cycle

Current product

Revised

IEC TR 62258-3:2005 ED1
Stage 99.60
Revised by

Published

IEC TR 62258-3:2010 ED2

IEC TR 62258-3:2005 ED1

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IEC TR 62258-3:2010 ED2