Standard

ISO 9453:2006

Withdrawn

Note: This standard has a new edition: ISO 9453:2020

Corrigendums and amendments are bought separately.

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Abstract

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth. ISO 9453:2006 also includes an indication of the forms generally available.

Document information

  • Standard from ISO
  • Published:
  • Withdrawn:
  • Expires:
  • Edition: 2
  • Version: 1
  • Document type: IS
  • ICS 25.160.50
  • ISO TC ISO/TC 44/SC 12

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