Standard

NEK EN 60068-2-54:2006

Aug 2006 Withdrawn

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Abstract

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Document information

Standard from NEK
Published: 7 August 2006
Withdrawn: 11 April 2020
Edition: 2006-08
Version: 1
Document type: NAT
ISBN:

ICS 19.040
ICS 31.020
National Committee NEK/NK91

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Replaced by: NEK EN 60068-2-69:2017
Adopted from: EN 60068-2-54:2006 , 0

NEK EN 60068-2-54:2006

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Abstract

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