Standard

NEK EN 60068-2-54:2006

Tilbaketrukket
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Rettelser og tillegg kjøpes separat.

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Omfang

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Tilbaketrukket:
  • Utgave: 2006-08
  • Versjon: 1
  • Varetype: NAT
  • ICS 19.040
  • ICS 31.020
  • National Committee NEK/NK91

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