Standard

NEK EN 61192-5:2007

Oct 2007 Withdrawn

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Abstract

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.

Document information

Standard from NEK
Published: 15 October 2007
Withdrawn: 3 April 2019
Edition: 1
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

Product Relations

Refers: NEK EN 61190-1-2:2007
Adopted from: EN 61192-5:2007 , 0

NEK EN 61192-5:2007

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Abstract

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Abstract

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