Standard

NEK EN 61190-1-2:2007

Withdrawn

Note: This standard has a new edition: NEK EN 61190-1-2:2014

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Abstract

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Document information

  • Standard from NEK
  • Published:
  • Withdrawn:
  • Edition: 1
  • Version: 1
  • Document type: NAT
  • ICS 31.190
  • National Committee NEK/NK91

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