Standard

NEK EN 62137-1-3:2009

Apr 2009 Published

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Abstract

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

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Standard from NEK
Published: 1 April 2009
Edition: 1
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

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Refers: NEK EN 61190-1-2:2007
Adopted from: EN 62137-1-3:2009 , 0

NEK EN 62137-1-3:2009

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Abstract

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Abstract

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