Standard

NS-EN ISO 9453:2006

Feb 2007 Withdrawn

Note: This standard has a new edition: NS-EN ISO 9453:2020

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Abstract

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.ISO 9453:2006 also includes an indication of the forms generally available.

Document information

Standard from SN
Published: 1 February 2007
Withdrawn: 1 November 2014
Edition: 2006-10
Version: 1
Document type: NAT
ISBN:

ICS 25.160.50
National Committee SN/K 67

Product Relations

Replaced by: NS-EN ISO 9453:2014
Referred by: NEK EN 61190-1-2:2007
Replaces: NS-ISO 9453:1990
Adopted from: EN ISO 9453:2006 , 0

Product life cycle

Previous product

Withdrawn

NS-ISO 9453:1990
Current product

Withdrawn

NS-EN ISO 9453:2006
Replaced by

Withdrawn

NS-EN ISO 9453:2014

NS-EN ISO 9453:2006

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NS-EN ISO 9453:2020

NS-EN ISO 9453:2014