Standard

NEK EN 62047-25:2016

Dec 2016 Published

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Abstract

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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Standard from NEK
Published: 1 December 2016
Edition: 1
Version: 1
Document type: NAT
ISBN:

ICS 31.080.99
National Committee NEK/NK47

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Refers: NS-EN ISO 10012:2003
Adopted from: EN 62047-25:2016 , 0

NEK EN 62047-25:2016

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Abstract

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