Standard

NEK EN 62047-25:2016

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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Utgave: 1
  • Versjon: 1
  • Varetype: NAT
  • ICS 31.080.99
  • National Committee NEK/NK47

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