Standard

NEK EN IEC 60286-3:2022

Jan 2023 Published

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Abstract

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Document information

Standard from NEK
Published: 2 January 2023
Edition: 2022-12
Version: 1
Document type: NAT
ISBN:

ICS 31.020
ICS 31.240
National Committee NEK/NK40

Product Relations

Refers: NEK EN IEC 61340-4-7:2025
Replaces: NEK EN IEC 60286-3:2019
Adopted from: EN IEC 60286-3:2022 , 0

NEK EN IEC 60286-3:2022

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