Standard

NEK EN IEC 61760-3:2021

Apr 2021 Published

Corrigendums and amendments are bought separately.

Language English

Services Read Online (No printing ) kr 3 239,00 Printed and bound Delivery time: 5-10 days kr 4 049,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.

Document information

Standard from NEK
Published: 1 April 2021
Edition: 2021-03
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

Product Relations

Refers: NEK EN IEC 61188-6-4:2019
Replaces: NEK EN 61760-3:2010
Adopted from: EN IEC 61760-3:2021 , 0

NEK EN IEC 61760-3:2021

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer