Standard

NEK IEC 61760-2:2007

Apr 2007 Withdrawn

Note: This standard has a new edition: NEK IEC 61760-2:2021

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Document information

Standard from NEK
Published: 24 April 2007
Withdrawn: 16 July 2021
Edition: 2.0
Version: 1
Document type: NAT
ISBN:

ICS 31.240
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 61760-2:2021
Replaces: NEK IEC 61760-2:1998
Adopted from: IEC 61760-2:2007

NEK IEC 61760-2:2007

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NEK IEC 61760-2:2021