Standard

NS-EN ISO 9455-17:2006

Oct 2006 Withdrawn

Note: This standard has a new edition: NS-EN ISO 9455-17:2024

Corrigendums and amendments are bought separately.

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Abstract

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Document information

Standard from SN
Published: 1 October 2006
Withdrawn: 22 February 2024
Edition: 2006-06
Version: 1
Document type: NAT
ISBN:

ICS 25.160.50
National Committee SN/K 67

Product Relations

Replaced by: NS-EN ISO 9455-17:2024
Refers: IEC 61249-2-7:2002 ED1
Refers: ISO 5725-2:1994
Refers: NS-ISO 9453:1990
Refers: IEC 60068-2-20:1979 ED4
Adopted from: EN ISO 9455-17:2006 , 0

Product life cycle

Current product

Withdrawn

NS-EN ISO 9455-17:2006
Replaced by

Draft

prNS-EN ISO 9455-17:2022

Published

NS-EN ISO 9455-17:2024

NS-EN ISO 9455-17:2006

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NS-EN ISO 9455-17:2024