Standard

NS-EN ISO 9455-17:2024

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This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

Dokumentinformasjon

  • Standard fra SN
  • Publisert:
  • Utgave: 2024-01
  • Versjon: 1
  • Varetype: NAT
  • ICS 25.160.50
  • National Committee SN/K 67

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