Standard

Beklager, dette produktet er ikke lenger tilgjengelig

prNS-EN ISO 9455-17:2022

Tilbaketrukket

Merknad: Denne standarden har en ny utgave: NS-EN ISO 9455-17:2024

Forhåndsvisning
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Omfang

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Dokumentinformasjon

  • Standard fra SN
  • Publisert:
  • Utgave: 2022-08
  • Versjon: 1
  • Varetype: NAT
  • ICS 25.160.50
  • National Committee SN/K 58

Produktrelasjon

Produkt livssyklus