Standard

IEC 60068-2-58:1989 ED1

Aug 1989 Revised

Note: This standard has a new edition: IEC 60068-2-58:2015+AMD1:2017 CSV

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Language English/French

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Abstract

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Document information

Standard from IEC
Published: 15 August 1989
Withdrawn: 15 January 1999
Edition: 1
Version: 1
Document type: IS
ISBN: 2831816602

ICS 19.040
ICS 31.190
ISO TC TC 91

Product Relations

Revised by: IEC 60068-2-58:1999 ED2
Adopted by: NEK IEC 60118-0:1983

Product life cycle

Current product

Revised

IEC 60068-2-58:1989 ED1
Stage 99.60
Revised by

Revised

IEC 60068-2-58:1999 ED2

IEC 60068-2-58:1989 ED1

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IEC 60068-2-58:2015+AMD1:2017 CSV

IEC 60068-2-58:2015 ED4

IEC 60068-2-58:2004 ED3

IEC 60068-2-58:1999 ED2