Standard

IEC 60068-2-58:1999 ED2

Jan 1999 Revised

Note: This standard has a new edition: IEC 60068-2-58:2015+AMD1:2017 CSV

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Language English

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Abstract

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Document information

Standard from IEC
Published: 15 January 1999
Withdrawn: 15 July 2004
Edition: 2
Version: 1
Document type: IS
ISBN: 2831846277

ICS 19.040
ICS 31.190
ISO TC TC 91

Product Relations

Revised by: IEC 60068-2-58:2004 ED3
Adopted by: NEK IEC 60118-1:1995
Revises: IEC 60068-2-58:1989 ED1

Product life cycle

Previous product

Revised

IEC 60068-2-58:1989 ED1
Current product

Revised

IEC 60068-2-58:1999 ED2
Stage 99.60
Revised by

Revised

IEC 60068-2-58:2004 ED3

IEC 60068-2-58:1999 ED2

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IEC 60068-2-58:2015+AMD1:2017 CSV

IEC 60068-2-58:2015 ED4

IEC 60068-2-58:2004 ED3