Standard

IEC TR 60068-3-12:2014 ED2

Revised

Note: This standard has a new edition: IEC TR 60068-3-12:2022 ED3

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Abstract

IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition: - the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes; - minor language adjustments were performed.

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 2
  • Version: 1
  • Document type: TR
  • ICS 19.040
  • ISO TC TC 91

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