Standard

IEC TR 60068-3-12:2007 ED1

Mar 2007 Revised

Note: This standard has a new edition: IEC TR 60068-3-12:2022 ED3

Corrigendums and amendments are bought separately.

Language English

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Abstract

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

Document information

Standard from IEC
Published: 12 March 2007
Withdrawn: 17 October 2014
Edition: 1
Version: 1
Document type: TR
ISBN: 2831890586

ICS 19.040
ISO TC TC 91

Product Relations

Revised by: IEC TR 60068-3-12:2014 ED2

Product life cycle

Current product

Revised

IEC TR 60068-3-12:2007 ED1
Stage 99.60
Revised by

Revised

IEC TR 60068-3-12:2014 ED2

IEC TR 60068-3-12:2007 ED1

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IEC TR 60068-3-12:2022 ED3

IEC TR 60068-3-12:2014 ED2