Standard

NEK EN 60068-2-58:2004

Oct 2004 Withdrawn

Note: This standard has a new edition: NEK EN 60068-2-58:2015

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Language English

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Abstract

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Document information

Standard from NEK
Published: 1 October 2004
Withdrawn: 1 May 2018
Edition: 1
Version: 1
Document type: NAT
ISBN:

ICS 19.040
ICS 31.190
National Committee NEK/NK91

Product Relations

Replaced by: NEK EN 60068-2-58:2015
Adopted from: EN 60068-2-58:2004 , 0

NEK EN 60068-2-58:2004

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NEK EN 60068-2-58:2015