Standard

NEK EN 60068-2-58:2004

Tilbaketrukket

Merknad: Denne standarden har en ny utgave: NEK EN 60068-2-58:2015

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Rettelser og tillegg kjøpes separat.

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Omfang

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Tilbaketrukket:
  • Utgave: 1
  • Versjon: 1
  • Varetype: NAT
  • ICS 19.040
  • ICS 31.190
  • National Committee NEK/NK91

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